The Scia Multi 300, the new magnetron sputter system by German thin film equipment manufacturer Scia Systems (Chemnitz, Germany), produces precise multilayer-stacks on 300 mm wafers.
In the volume production of semiconductor components, the yield of usable elements is a crucial factor when selecting the equipment. According to the company, one way to improve the yield is to use 300 mm wafers (12″) instead of the long common 200 mm (8″) wafers, since less edge area is unusable here.
Scia Systems says the Scia Multi 300 system was especially designed for the deposition of high-quality multilayers on wafers up to 300 mm. Up to four magnetron sputter targets enable coating with different materials without interrupting the vacuum, which reportedly significantly speeds up the production time for a substrate. In order to guarantee uniformity and reproducibility of each individual layer stack, Scia Systems has developed a process configuration with combined orbital and spin rotation for the wafer within the process chamber, while the face-down orientation of the wafer is said to ensure minimal particle load.
The Scia Multi 300 is designed for deposition of metal layers as well as oxide and nitride layers. The cassette load lock with automatic substrate handling and the in-house developed control software enables a completely automatic and recipe-controlled process. In addition the system is also said to be suitable for optics processing (for example, gradient multilayer deposition for anti-reflective coatings and extreme ultraviolet applications).